- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/38 - Cooling arrangements using the Peltier effect
Patent holdings for IPC class H01L 23/38
Total number of patents in this class: 368
10-year publication summary
29
|
30
|
29
|
32
|
26
|
30
|
41
|
41
|
42
|
9
|
2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Intel Corporation | 45621 |
22 |
Taiwan Semiconductor Manufacturing Company, Ltd. | 36809 |
16 |
Samsung Electronics Co., Ltd. | 131630 |
13 |
Sony Semiconductor Solutions Corporation | 8770 |
13 |
GLOBALFOUNDRIES U.S. Inc. | 6459 |
11 |
Qualcomm Incorporated | 76576 |
9 |
Commissariat à l'énergie atomique et aux energies alternatives | 10525 |
9 |
Analog Devices, Inc. | 3475 |
8 |
Texas Instruments Incorporated | 19376 |
6 |
Huawei Technologies Co., Ltd. | 100781 |
6 |
Dell Products L.P. | 11144 |
6 |
Panasonic Intellectual Property Management Co., Ltd. | 27812 |
5 |
Boe Technology Group Co., Ltd. | 35384 |
5 |
Adeia Semiconductor Bonding Technologies Inc. | 185 |
5 |
Fujitsu Limited | 19265 |
4 |
Micron Technology, Inc. | 24960 |
4 |
Advanced Micro Devices, Inc. | 5326 |
4 |
Baidu USA LLC | 1085 |
4 |
Lintec Corporation | 1915 |
4 |
STMicroelectronics (Rousset) SAS | 952 |
3 |
Other owners | 211 |